Curriculum in preparation

Design rigid-flex and HDI PCBs for advanced applications. Covers flex circuit design rules, bend radius constraints, rigid-flex stackup, HDI microvia design, blind and buried vias, any-layer HDI, and DFM in rigid-flex. Targeted at engineers designing wearable, medical, aerospace, and mobile product

Curriculum in preparation

Design PCBs that pass EMI/EMC compliance testing first time. Covers EMC fundamentals, radiated and conducted emission sources, PCB layout techniques (ground planes, filtering, shielding), common-mode suppression, ESD protection, and pre-compliance testing. Includes FCC Part 15 and CE marking require

Curriculum in preparation

Ensure clean power delivery on your PCB. Covers PDN analysis, decoupling capacitor selection and placement, power plane design, VRM transient response, AC impedance optimisation, and PI simulation using SIwave/PowerSI to eliminate PCB bring-up failures.

Curriculum in preparation

Design PCBs for high-speed digital interfaces without signal integrity failures. Covers controlled impedance design, stackup planning, DDR4/DDR5 PCB routing rules, termination strategies, reflection and crosstalk mitigation, and SI simulation using HyperLynx/Sigrity targeting DDR5 and PCIe Gen4 host

Curriculum in preparation

Master PCB layout and routing for reliable hardware design. Covers layer stackup design, trace width and impedance calculation, component placement strategies, differential pair routing, length matching, copper pours, via selection, and Gerber file generation with hands-on 4-layer PCB projects.

Curriculum in preparation

Learn PCB design from the ground up. Covers electronic schematic capture in Altium Designer and KiCad, component library creation, netlist generation, BOM management, and design rule setup. Ideal for ECE graduates and embedded engineers designing PCBs for embedded and IoT hardware projects.

Curriculum in preparation

Implement security in embedded systems from bootloader to application. Covers secure boot chain of trust, ARM TrustZone (Cortex-M33/A), firmware signing and verification, AES/RSA/ECC hardware accelerators, secure key storage, IoT Security PSA certification, and embedded vulnerability mitigations.

Curriculum in preparation

Connect embedded devices to the IoT cloud with industry-standard wireless protocols. Covers MQTT publisher/subscriber model, BLE GAP/GATT profiles, Zigbee mesh networking, LoRaWAN, and Wi-Fi power management. Hands-on projects send sensor data from Nordic nRF52 and ESP32 modules to cloud dashboards.

Curriculum in preparation

Build and customise Embedded Linux for hardware products. Covers bootloader (U-Boot), kernel configuration and compilation, Yocto Project and Buildroot, root filesystem creation, kernel driver integration, and board-specific BSP development. Projects build a complete custom Embedded Linux image from